Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8921222 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Chen-Shien Chen | 2014-12-30 |
| 8906712 | Light emitting diode and method of fabrication thereof | Hsin-Hsien Wu, Chyi Shyuan Chern, Chun-Lin Chang, Kuang-Huan Hsu | 2014-12-09 |
| 8889484 | Apparatus and method for a component package | Chih-Hua Chen, Chen-Shien Chen, Ming Hung Tseng | 2014-11-18 |
| 8871609 | Thin wafer handling structure and method | Chen-Hua Yu, Kuo-Ching Hsu, Chen-Shien Chen | 2014-10-28 |
| 8866285 | Fan-out package comprising bulk metal | Yen-Chang Hu, Chang-Chia Huang, Chen-Shien Chen | 2014-10-21 |
| 8855486 | Remotely controlled fiber testing method | Shih-Tien Lin, Fu-Chun Hung, Yu-Shu Chen, Chun-Hung Su | 2014-10-07 |
| 8847387 | Robust joint structure for flip-chip bonding | Yao-Chun Chuang, Chen-Shien Chen, Chen-Cheng Kuo, Ru-Ying Huang | 2014-09-30 |
| 8837937 | Detecting device for detecting insertion loss and return loss of individual events in an optical fiber network | Hsuan-Hung Wu, Shih-Tien Lin, Fu-Chun Hung, Yu-Shu Chen, Ching-Lin Wu +1 more | 2014-09-16 |
| 8816507 | Package-on-Package structures having buffer dams and method for forming the same | Yen-Chang Hu, Chen-Shien Chen | 2014-08-26 |
| 8803319 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Chen-Shien Chen | 2014-08-12 |
| 8765497 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2014-07-01 |
| 8766441 | Methods and apparatus for solder on slot connections in package on package structures | Wei Sen Chang, Chen-Shien Chen | 2014-07-01 |
| 8736050 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Kuo-Ching Hsu, Chen-Shien Chen | 2014-05-27 |
| 8653626 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Hsu-Hsien Chen, Chen-Shien Chen | 2014-02-18 |
| 8624360 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Tsung-Ding Wang, Ming-Hong Tseng, Chen-Shien Chen | 2014-01-07 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2013-11-19 |
| 8546945 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Chen-Shien Chen | 2013-10-01 |
| 8349628 | Methods of fabricating light emitting diode devices | Yung-Chang Chen, Hsin-Hsien Wu, Chyi Shyuan Chern, Fu-Wen Liu, Kuang-Huan Hsu | 2013-01-08 |
| 8318596 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Chen-Shien Chen | 2012-11-27 |
| 8314482 | Semiconductor package device | Shou-Lung Chen, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2012-11-20 |
| 8299616 | T-shaped post for semiconductor devices | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2012-10-30 |
| 8232643 | Lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2012-07-31 |
| 8178970 | Strong interconnection post geometry | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2012-05-15 |
| 8158489 | Formation of TSV backside interconnects by modifying carrier wafers | Hon-Lin Huang, Kuo-Ching Hsu, Chen-Shien Chen | 2012-04-17 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Ming-Hong Tseng, Kai-Ming Ching, Chen-Shien Chen, Hon-Lin Huang, Tsung-Ding Wang | 2012-01-17 |