Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177125 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2019-01-08 |
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Yen-Chang Hu | 2019-01-08 |
| 10163873 | Package-on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2018-12-25 |
| 10134706 | Warpage control of semiconductor die package | Kuo Lung Pan, Chen-Shien Chen | 2018-11-20 |
| 10079192 | Semiconductor chip package assembly with improved heat dissipation performance | Tzu-Hung Lin, I-Hsuan Peng, Tung-Hsien Hsieh, Sheng-Ming Chang | 2018-09-18 |
| 10032756 | Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng | 2018-07-24 |
| 10008479 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2018-06-26 |
| 9997498 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2018-06-12 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, Nai-Wei Liu, I-Hsuan Peng, Wei-Che Huang | 2018-04-10 |
| 9911725 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2018-03-06 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2018-01-02 |
| 9837289 | Methods for forming package-on-package structures having buffer dams | Shou-Cheng Hu, Chen-Shien Chen | 2017-12-05 |
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Yen-Chang Hu, Chen-Shien Chen | 2017-10-24 |
| 9786632 | Semiconductor package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng | 2017-10-10 |
| 9773749 | Warpage control of semiconductor die package | Kuo Lung Pan, Chen-Shien Chen | 2017-09-26 |
| 9761503 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2017-09-12 |
| 9748216 | Apparatus and method for a component package | Chih-Hua Chen, Chen-Shien Chen, Ming Hung Tseng | 2017-08-29 |
| 9735087 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Yen-Chang Hu | 2017-08-15 |
| 9711488 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2017-07-18 |
| 9704836 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2017-07-11 |
| 9679836 | Package structures and methods for forming the same | Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9666522 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-05-30 |
| 9646894 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2017-05-09 |
| 9613917 | Package-on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2017-04-04 |
| 9607936 | Copper bump joint structures with improved crack resistance | Jiun Yi Wu, Ru-Ying Huang, Chen-Shien Chen | 2017-03-28 |