Issued Patents All Time
Showing 51–75 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062659 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-08-28 |
| 10056312 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2018-08-21 |
| 10050001 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2018-08-14 |
| 10015888 | Interconnect joint protective layer apparatus and method | Cheng-Ting Chen, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2018-06-12 |
| 9935070 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2017-10-03 |
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9768136 | Interconnect structure and method of fabricating same | Wei-Yu Chen, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Chia-Wei Tu, Ming-Da Cheng, Yu-Peng Tsai | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9607921 | Package on package interconnect structure | Yi-Wen Wu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9598772 | Method for fabricating bump structure without UBM undercut | Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-21 |
| 9589862 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9576830 | Method and apparatus for adjusting wafer warpage | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Yu-Peng Tsai, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9449933 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2016-09-20 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Chien Ling Hwang +2 more | 2016-09-20 |
| 9437564 | Interconnect structure and method of fabricating same | Hsuan-Ting Kuo, Cheng-Ting Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9396973 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Hung-Jen Lin | 2016-07-19 |
| 9385076 | Semiconductor device with bump structure on an interconncet structure | Hsien-Wei Chen, Yi-Wen Wu | 2016-07-05 |
| 9385040 | Method of manufacturing a semiconductor device | Tsai-Tsung Tsai, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |