Issued Patents All Time
Showing 101–111 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Chien Ling Hwang +2 more | 2014-09-02 |
| 8809117 | Packaging process tools and packaging methods for semiconductor devices | Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2014-08-19 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Ming-Da Cheng, Chih-Wei Lin, Yi-Wen Wu, Hsiu-Jen Lin, Chung-Shi Liu +2 more | 2014-05-27 |
| 8659155 | Mechanisms for forming copper pillar bumps | Ming-Da Cheng, Chih-Wei Lin, Ching-Wen Chen, Yi-Wen Wu, Chia-Tung Chang +2 more | 2014-02-25 |
| 8603860 | Process for forming packages | Meng-Tse Chen, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2013-12-10 |
| 8581401 | Mechanisms for forming copper pillar bumps using patterned anodes | Ming-Da Cheng, Chih-Wei Lin, Chung-Shi Liu | 2013-11-12 |
| 8546254 | Mechanisms for forming copper pillar bumps using patterned anodes | Ming-Da Cheng, Chih-Wei Lin, Chung-Shi Liu | 2013-10-01 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Zheng-Yi Lim +2 more | 2013-08-06 |
| 8492891 | Cu pillar bump with electrolytic metal sidewall protection | Ming-Da Cheng, Chih-Wei Lin, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2013-07-23 |
| 8405199 | Conductive pillar for semiconductor substrate and method of manufacture | Ming-Da Cheng, Chih-Wei Lin, Ming-Che Ho, Chung-Shi Liu | 2013-03-26 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Yi-Wen Wu, Chih-Wei Lin, Tzong-Huann Yang, Hsiu-Jen Lin +2 more | 2012-08-14 |