Issued Patents All Time
Showing 76–100 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2016-06-21 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9368398 | Interconnect structure and method of fabricating same | Wei-Yu Chen, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2016-06-14 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9355906 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2016-05-31 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-15 |
| 9269658 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2016-02-23 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-02-16 |
| 9257333 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9218999 | Packaging process tools and packaging methods for semiconductor devices | Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2015-12-22 |
| 9196559 | Directly sawing wafers covered with liquid molding compound | Yu-Peng Tsai, Chia-Wei Tu, Ming-Da Cheng, Chung-Shi Liu | 2015-11-24 |
| 9196532 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Yian-Liang Kuo, Hsien-Wei Chen, Tsung-Fu Tsai | 2015-11-24 |
| 9117816 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2015-08-25 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2015-07-14 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 9059109 | Package assembly and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2015-06-16 |
| 9006097 | Cu pillar bump with electrolytic metal sidewall protection | Ming-Da Cheng, Chih-Wei Lin, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2015-04-14 |
| 8987058 | Method for wafer separation | Yu-Peng Tsai, Cheng-Ting Chen, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2015-03-24 |
| 8987922 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Hung-Jen Lin | 2015-03-24 |
| 8975741 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2015-03-10 |
| 8937388 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Chia-Wei Tu, Chung-Shi Liu | 2015-01-20 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Hsiu-Jen Lin, Bor-Ping Jang, Chung-Shi Liu +7 more | 2014-11-11 |