KH

Kuo-Ching Hsu

TSMC: 56 patents #575 of 12,232Top 5%
NM Novatek Microelectronics: 10 patents #77 of 986Top 8%
Overall (All Time): #32,593 of 4,157,543Top 1%
66
Patents All Time

Issued Patents All Time

Showing 51–66 of 66 patents

Patent #TitleCo-InventorsDate
8476769 Through-silicon vias and methods for forming the same Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo, Kai-Ming Ching 2013-07-02
8461045 Bond pad connection to redistribution lines having tapered profiles Chen-Shien Chen, Hon-Lin Huang 2013-06-11
8461883 Frequency generator Chin-Hsun Hsu, Tsung-Hau Chang 2013-06-11
8427081 Driving apparatus of light emitting diode and driving method thereof Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao 2013-04-23
8344661 LED device with simultaneous open and short detection function and method thereof Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao 2013-01-01
8288969 Driving apparatus of light emitting diode and driving method thereof Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao 2012-10-16
8169156 Control method capable of preventing flicker effect and light emitting device thereof Tsung-Hau Chang, Chin-Hsun Hsu 2012-05-01
8158489 Formation of TSV backside interconnects by modifying carrier wafers Hon-Lin Huang, Ching-Wen Hsiao, Chen-Shien Chen 2012-04-17
8154223 Driving apparatus of light emitting diode and driving method thereof Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao 2012-04-10
8138691 Multi-channel driving circuit and driving method thereof 2012-03-20
8134304 Light source driving device capable of dynamically keeping constant current sink and related method Tsung-Hau Chang, Chin-Hsun Hsu 2012-03-13
8005326 Optical clock signal distribution using through-silicon vias Shih-Cheng Chang, Jin-Lien Lin, Kai-Ming Ching, Jiun Yi Wu, Yen-Huei Chen 2011-08-23
7956442 Backside connection to TSVs having redistribution lines Chen-Shien Chen 2011-06-07
7928534 Bond pad connection to redistribution lines having tapered profiles Chen-Shien Chen, Hon-Lin Huang 2011-04-19
7679926 Capacitors with insulating layer having embedded dielectric rods Chien-Min Lin, Tzong-Lin Wu, Guan-Tzong Wu 2010-03-16
7633165 Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV Chen-Shien Chen, Boe Su, Hon-Lin Huang 2009-12-15