Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-04-23 |
| 10163756 | Isolation structure for stacked dies | Hung-Pin Chang, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2018-12-25 |
| 9984981 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2018-05-29 |
| 9760670 | Semiconductor device design methods and conductive bump pattern enhancement methods | Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2017-09-12 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2017-07-04 |
| 9633869 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2017-04-25 |
| RE46330 | Driving apparatus of light emitting diode and driving method thereof | Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao | 2017-02-28 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu +1 more | 2017-02-14 |
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2016-11-29 |
| 9372951 | Semiconductor device design methods and conductive bump pattern enhancement methods | Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2016-06-21 |
| 9355980 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2016-05-31 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2016-05-24 |
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Meng-Liang Lin, Jy-Jie Gau, Cheng-Lin Huang, Jing-Cheng Lin | 2016-05-17 |
| 9312225 | Bump structure for stacked dies | Hung-Pin Chang, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2016-04-12 |
| 9299649 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2016-03-29 |
| 8901735 | Connector design for packaging integrated circuits | Chen-Hua Yu, Ying-Ching Shih, Po-Hao Tsai, Chin-Fu Kao, Cheng-Lin Huang +4 more | 2014-12-02 |
| 8871609 | Thin wafer handling structure and method | Chen-Hua Yu, Chen-Shien Chen, Ching-Wen Hsiao | 2014-10-28 |
| 8759949 | Wafer backside structures having copper pillars | Chen-Hua Yu, Hon-Lin Huang, Chen-Shien Chen | 2014-06-24 |
| 8736050 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2014-05-27 |
| 8670637 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kai-Ming Ching, Jiun Yi Wu, Yen-Huei Chen | 2014-03-11 |
| 8664760 | Connector design for packaging integrated circuits | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Cheng-Chieh Hsieh, Ying-Ching Shih +4 more | 2014-03-04 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2013-12-17 |
| 8610360 | LED device and method for preventing soft-start flicker | Chin-Hsun Hsu, Tsung-Hau Chang | 2013-12-17 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu +1 more | 2013-10-15 |
| 8513119 | Method of forming bump structure having tapered sidewalls for stacked dies | Hung-Pin Chang, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2013-08-20 |