HH

Hungen Hsu

TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #2,514,972 of 4,157,543Top 65%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12040266 Package substrate, package using the same, and method of manufacturing the same Wei-Tien Shen, Kuo-Ching Hsu 2024-07-16