Issued Patents All Time
Showing 51–75 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308313 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung | 2025-05-20 |
| 12300592 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2025-05-13 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2025-05-13 |
| 12300619 | Interposer with die to die bridge solution and methods of forming the same | Hsien-Wei Chen | 2025-05-13 |
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin | 2025-04-22 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Wen-Yi Lin, Shu-Shen Yeh | 2025-04-15 |
| 12272629 | Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials | Monsen Liu, Shuo-Mao Chen, Po-Ying LAI, Shang-Lun Tsai | 2025-04-08 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Che-Chia Yang, Po-Chen Lai, Po-Yao Lin | 2025-03-25 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin | 2025-03-18 |
| 12255078 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Chien-Sheng Chen | 2025-03-18 |
| 12255119 | Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Ming-Chih Yew | 2025-03-18 |
| 12255118 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2025-03-18 |
| 12249568 | Metallization structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2025-03-11 |
| 12249550 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2025-03-11 |
| 12243800 | Package structure with lid and method for forming the same | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2025-03-04 |
| 12237277 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Chia-Kuei Hsu | 2025-02-25 |
| 12237262 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung | 2025-02-25 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh +1 more | 2025-02-25 |
| 12232307 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin | 2025-02-18 |
| 12224266 | Semiconductor packages including passive devices and methods of forming same | Po-Yao Chuang, Shuo-Mao Chen | 2025-02-11 |
| 12218023 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin | 2025-02-04 |
| 12218080 | Package structure with reinforced element | Po-Yao Lin, Shuo-Mao Chen, Chia-Hsiang Lin | 2025-02-04 |
| 12218095 | Chip package structure having molding layer | Shuo-Mao Chen, Feng-Cheng Hsu | 2025-02-04 |