Issued Patents All Time
Showing 76–100 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205861 | Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen | 2025-01-21 |
| 12199084 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Meng-Wei Chou, Meng-Liang Lin | 2025-01-14 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |
| 12191272 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin | 2025-01-07 |
| 12191294 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin | 2025-01-07 |
| 12191261 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Meng-Wei Chou | 2025-01-07 |
| 12183714 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-12-31 |
| 12176258 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2024-12-24 |
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee +1 more | 2024-12-24 |
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2024-12-24 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2024-12-17 |
| 12170274 | Semiconductor packages and methods of forming same | Techi Wong, Po-Yao Chuang, Shuo-Mao Chen, Meng-Wei Chou | 2024-12-17 |
| 12165980 | Semiconductor package and methods of manufacturing | Hsien-Wei Chen, Meng-Liang Lin | 2024-12-10 |
| 12166025 | Semiconductor devices and methods of manufacturing | Chang-Yi Yang, Po-Yao Chuang | 2024-12-10 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin | 2024-11-26 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen | 2024-11-26 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin | 2024-11-19 |
| 12131984 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2024-10-29 |
| 12132021 | Method for fabricating semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2024-10-29 |
| 12125755 | Chip package structure with cavity in interposer | Feng-Cheng Hsu, Shuo-Mao Chen | 2024-10-22 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin | 2024-10-22 |
| 12125833 | Integrated circuit package and method forming same | Shuo-Mao Chen, Feng-Cheng Hsu | 2024-10-22 |
| 12119296 | Encircling a semiconductor device with stacked frames on a substrate | Chien-Hung Chen, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-10-15 |
| 12113006 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-10-08 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |