WL

Wen-Yi Lin

TSMC: 27 patents #1,273 of 12,232Top 15%
DP Darwin Precisions: 9 patents #3 of 76Top 4%
MT Microcoating Technologies: 6 patents #3 of 20Top 15%
MI Morton International: 4 patents #107 of 580Top 20%
ME Mediatek: 3 patents #879 of 2,888Top 35%
FT Far Eastern Textile: 2 patents #4 of 29Top 15%
AO Au Optronics: 1 patents #1,836 of 2,945Top 65%
GR Georgia Tech Research: 1 patents #1,150 of 2,755Top 45%
SL Shipley Company, L.L.C.: 1 patents #226 of 401Top 60%
ST S.O.I. Tec Silicon On Insulator Technologies: 1 patents #92 of 155Top 60%
FC Far Eastern New Century: 1 patents #43 of 103Top 45%
📍 Dashulong, GA: #2 of 3 inventorsTop 70%
Overall (All Time): #37,481 of 4,157,543Top 1%
61
Patents All Time

Issued Patents All Time

Showing 26–50 of 61 patents

Patent #TitleCo-InventorsDate
9583474 Package on packaging structure and methods of making same Jiun Yi Wu, Jing Ruei Lu, Po-Yao Lin, Ming-Chih Yew 2017-02-28
9548281 Electrical connection for chip scale packaging Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin 2017-01-17
9543284 3D packages and methods for forming the same Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu, Po-Yao Lin 2017-01-10
9502323 Method of forming encapsulated semiconductor device package Kuo-Chuan Liu, Po-Yao Lin, Cheng-Yi Hong, Ming-Chih Yew 2016-11-22
9252076 3D packages and methods for forming the same Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu 2016-02-02
8976529 Lid design for reliability enhancement in flip chip package Po-Yao Lin, Tsung-Shu Lin, Kuo-Chin Chang, Shou-Yi Wang 2015-03-10
8970029 Thermally enhanced heat spreader for flip chip packaging Po-Yao Lin 2015-03-03
8946888 Package on packaging structure and methods of making same Ming-Chih Yew, Po-Yao Lin, Jing Ruei Lu, Jiun Yi Wu 2015-02-03
8941248 Semiconductor device package and method Ming-Chih Yew, Cheng-Yi Hong, Po-Yao Lin, Kuo-Chuan Liu 2015-01-27
8901732 Semiconductor device package and method Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu 2014-12-02
8847369 Packaging structures and methods for semiconductor devices Ming-Chih Yew, Jiun Yi Wu, Po-Yao Lin 2014-09-30
8779582 Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas Po-Yao Lin 2014-07-15
8462510 Board-level package with tuned mass damping structure Po-Yao Lin 2013-06-11
8399891 Active device array substrate and method for fabricating the same Po-Lin Lai, Ying-Fa Huang, Chun-Ming Yang, Wen-Bin Wu 2013-03-19
8283777 Compressive ring structure for flip chip packaging Po-Yao Lin 2012-10-09
8146617 Check valve 2012-04-03
7956964 Optical device and method for making the same Tsai-An Yu, Pi-Sung Lin, Chih-Jen Chen, Chiu-Fang Huang 2011-06-07
7766260 Showerhead 2010-08-03
7532284 Optical device and method for making the same Tsai-An Yu, Pi-Sung Lin, Chih-Jen Chen, Chiu-Fang Huang 2009-05-12
7524739 Method of improving a surface of a semiconductor substrate 2009-04-28
7301594 Optical compensator for a liquid crystal display Tsai-An Yu, Pi-Sung Lin, Chih-Jen Chen, Chiu-Fang Huang 2007-11-27
7033637 Epitaxial thin films Andrew Tye Hunt, Girish Nilkanth Deshpande, Tzyy-Jiuan Jan 2006-04-25
6728092 Formation of thin film capacitors Andrew Tye Hunt, Tzyy Jiuan Hwang, Helmut G. Hornis 2004-04-27
6632591 Nanolaminated thin film circuitry materials Andrew Tye Hunt, Richard W. Carpenter 2003-10-14
6500350 Formation of thin film resistors Andrew Tye Hunt, Shara S. Shoup, Richard W. Carpenter, Stephen E. Bottomley, Tzyy Jiuan Hwang +1 more 2002-12-31