Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818651 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2020-10-27 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10725090 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2020-07-28 |
| 10718790 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2020-07-21 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Yu-Feng Chen +1 more | 2020-07-21 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan | 2019-11-26 |
| 10274518 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2019-04-30 |
| 10256203 | Semiconductor device and semiconductor package | Lipu Kris Chuang, Han-Ping Pu, Hsin-Yu Pan | 2019-04-09 |
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-12-18 |
| 9899982 | On-chip electromagnetic bandgap (EBG) structure for noise suppression | Ming-Hsien Tsai, Chien-Min Lin, Fu-Lung Hsueh, Han-Ping Pu, Sa-Lly Liu | 2018-02-20 |
| 9891266 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2018-02-13 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-01-23 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai | 2017-05-16 |
| 9406648 | Power supply arrangement for semiconductor device | Chuei-Tang Wang, Monsen Liu, Chen-Hua Yu | 2016-08-02 |
| 9354254 | Test-yield improvement devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2016-05-31 |