Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312112 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Kai-Chiang Wu | 2019-06-04 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao | 2018-12-18 |
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ming-Kai Liu +5 more | 2018-08-07 |
| 9966321 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2018-05-08 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-10-31 |
| 9659879 | Semiconductor device having a guard ring | Chun-Lin Lu, Kai-Chiang Wu, Vincent Chen | 2017-05-23 |
| 9653341 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Chao-Wen Shih, Shih-Wei Liang | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-01-31 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao | 2017-01-10 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2017-01-10 |
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2016-11-15 |
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Ming-Kai Liu, Kai-Chiang Wu | 2016-08-09 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2015-07-14 |
| 6813166 | Synchronous rectifyier controlled by a current transformer | Shun-Te Chang | 2004-11-02 |