Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343415 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Chen-Chih Hsieh, Hao-Yi Tsai | 2016-05-17 |
| 9035468 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Chen-Chih Hsieh, Hao-Yi Tsai | 2015-05-19 |