Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804245 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2020-10-13 |
| 10790210 | Semiconductor package and manufacturing method thereof | Chien-Hsun Lee, Yu-Min Liang | 2020-09-29 |
| 10777467 | Semiconductor structure and manufacturing method thereof | Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2020-09-15 |
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2020-06-30 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2020-04-14 |
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee | 2019-12-31 |
| 10468307 | Semiconductor structure and manufacturing method thereof | Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2019-11-05 |
| 10276508 | Semiconductor packages and methods of forming the same | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2019-04-23 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu | 2018-12-18 |
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Chin-Liang Chen | 2018-11-27 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2018-04-10 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2018-01-09 |
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu | 2017-11-07 |
| 9666556 | Flip chip packaging | Yu-Chih Liu, Chien-Kuo Chang, Jing Ruei Lu, Chih-Hao Lin | 2017-05-30 |