Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691723 | Connector formation methods and packaged semiconductor devices | Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2017-05-16 |
| 9570368 | Method of manufacturing semiconductor package including forming a recessed region in a substrate | Tsung-Ding Wang, Bo-I Lee | 2017-02-14 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Tsung-Ding Wang, Hung-Jen Lin | 2017-02-07 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Tsung-Ding Wang, Chien-Hsun Lee | 2016-09-06 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Tsung-Ding Wang, Bo-I Lee | 2016-08-02 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9318465 | Methods for forming a semiconductor device package | Tsung-Ding Wang, Chien-Hsun Lee, Chun-Chih Chuang | 2016-04-19 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Tsung-Ding Wang, Bo-I Lee | 2016-03-01 |
| 9177835 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Chun-Hung Lin, Tsung-Ding Wang | 2015-11-03 |
| 9165876 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2015-10-20 |
| 9006032 | Package on package structures and methods for forming the same | Tsung-Ding Wang, Chien-Hsun Lee, Chun-Chih Chuang | 2015-04-14 |
| 8991314 | Roller microcontact printing device and printing method thereof | Chang-Pen Chen, Jeng-Rong Ho, Bo-Wei Li, Yeh-Min Lin | 2015-03-31 |
| 8704354 | Package on package structures and methods for forming the same | Tsung-Ding Wang, Chien-Hsun Lee, Chun-Chih Chuang | 2014-04-22 |
| 8671881 | Thickness adjustment device for thin-film coating | Chang-Pen Chen, Jeng-Rong Ho, Bo-Ying Li, Yeh-Min Lin | 2014-03-18 |
| 8658464 | Mold chase design for package-on-package applications | Chien-Hsiun Lee, Tsung-Ding Wang, Chun-Chih Chuang | 2014-02-25 |