Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Tsung-Ding Wang | 2021-08-10 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Hsin-Yu Pan, Chen-Hua Yu | 2020-12-15 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou | 2020-10-27 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2020-07-14 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Chien-Hsun Lee | 2019-12-31 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou | 2019-12-10 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang | 2019-06-11 |
| 10163710 | Method of manufacturing semiconductor device by applying molding layer in substrate groove | Tsung-Ding Wang, Bo-I Lee | 2018-12-25 |
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Chin-Liang Chen | 2018-11-27 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Yu-Min Liang, Tsung-Ding Wang | 2018-11-13 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Hung-Jen Lin, Tsung-Ding Wang | 2018-09-11 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2018-08-21 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Ming-Che Liu +2 more | 2018-07-17 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Hsin-Yu Pan, Chen-Hua Yu | 2018-07-10 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9935090 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2018-04-03 |
| 9929115 | Device with optimized thermal characteristics | Hao-Cheng Hou, Tsung-Ding Wang, Ming-Che Liu | 2018-03-27 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Yu-Min Liang, Tsung-Ding Wang | 2018-03-13 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Chien Ling Hwang, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Tsung-Ding Wang, Hung-Jen Lin | 2018-01-02 |
| 9837292 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Chun-Hung Lin, Tsung-Ding Wang | 2017-12-05 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Ping-Kang Huang +2 more | 2017-11-21 |
| 9721916 | Concentric bump design for the alignment in die stacking | Tsung-Ding Wang, Chien-Hsun Lee | 2017-08-01 |