Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256203 | Semiconductor device and semiconductor package | Lipu Kris Chuang, Han-Ping Pu, Sen-Kuei Hsu | 2019-04-09 |
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Sheng-Hsiang Chiu, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2018-12-18 |
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Han-Ping Pu +1 more | 2018-12-18 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Chen-Hua Yu | 2018-07-10 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Han-Ping Pu +1 more | 2018-01-23 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Han-Ping Pu | 2018-01-02 |
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Han-Ping Pu, Pei-Haw Tsao, Yu-Chen Hsu | 2017-10-03 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hao-Yi Tsai, Sen-Kuei Hsu | 2017-05-16 |
| 9547398 | Substrate with touch function and display using the same | Chung-Min Lien, Han-Ming Chen | 2017-01-17 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2017-01-10 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang | 2016-11-22 |
| 9035916 | Optical touch display panel | Chung-Min Lien, Yueh-Hung Chung, Ya-Ling Hsu | 2015-05-19 |
| 8993378 | Flip-chip BGA assembly process | Yu-Chih Liu, Jing Ruei Lu, Wei-Ting Lin, Sao-Ling Chiu | 2015-03-31 |
| 8810025 | Reinforcement structure for flip-chip packaging | Yu-Wen Liu, Ching-Jung Yang, Hsien-Wei Chen, Chao-Wen Shih | 2014-08-19 |
| 8026567 | Thermoelectric cooler for semiconductor devices with TSV | Shih-Cheng Chang | 2011-09-27 |
| 7864548 | Synchronous rectifier control device and forward synchronous rectifier circuit | Chun-Ming Lin | 2011-01-04 |
| 7583502 | Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) | Pei-Haw Tsao | 2009-09-01 |
| 7514775 | Stacked structures and methods of fabricating stacked structures | Clinton Chao, Tsorng-Dih Yuan, Kim Chen, Mark Shane Peng, Tjandra Winata Karta | 2009-04-07 |
| 7361986 | Heat stud for stacked chip package | Tsorng-Dih Yuan, Chung-Yi Lin | 2008-04-22 |
| 7348218 | Semiconductor packages and methods of manufacturing thereof | Ching-Yu Ni, Tsorng-Dih Yuan | 2008-03-25 |
| 7138300 | Structural design for flip-chip assembly | Tsorng-Dih Yuan, Chung-Yi Lin | 2006-11-21 |
| 7135769 | Semiconductor packages and methods of manufacturing thereof | Ching-Yu Ni, Tsorng-Dih Yuan | 2006-11-14 |