Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko | 2023-01-10 |
| 11532576 | Semiconductor package and manufacturing method thereof | Sen-Kuei Hsu, Yi-Che Chiang | 2022-12-20 |
| 11508666 | Semiconductor package | Sen-Kuei Hsu, Chien-Chang Lin | 2022-11-22 |
| 11450581 | Integrated circuit package and method | Teng-Yuan Lo, Lipu Kris Chuang | 2022-09-20 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Sen-Kuei Hsu, Yi-Che Chiang | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11296067 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2022-04-05 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Chi-Yang Yu, Hao-Cheng Hou, Tsung-Ding Wang | 2021-10-12 |
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Lipu Kris Chuang, Chung-Hao Tsai, Yi-Che Chiang, Chien-Chang Lin | 2021-05-25 |
| 11004812 | Package structure and method of forming the same | Tuan-Yu Hung, Hung-Jui Kuo, Ming-Che Ho, Tzu-Yun Huang, Yen-Fu Su | 2021-05-11 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu +1 more | 2020-12-22 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Chen-Hua Yu | 2020-12-15 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Sen-Kuei Hsu | 2020-12-15 |
| 10840197 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2020-11-17 |
| 10818651 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2020-10-27 |
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Sen-Kuei Hsu, Yi-Che Chiang | 2020-10-27 |
| 10811384 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-10-20 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-07-21 |
| 10672681 | Semiconductor packages | Chien-Chang Lin, Lipu Kris Chuang, Ming-Chang Lu | 2020-06-02 |
| 10510713 | Semicondcutor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2019-12-17 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Sen-Kuei Hsu | 2019-11-26 |