Issued Patents All Time
Showing 26–50 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2025-03-18 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2025-02-18 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2025-02-11 |
| 12218020 | Semiconductor packages | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2025-02-04 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2025-01-28 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12193168 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2025-01-07 |
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chien-Hsun Lee, Jiun Yi Wu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12170267 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2024-12-17 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-12-03 |
| 12159822 | Method of manufacturing a semiconductor package having conductive pillars | Jiun Yi Wu, Chen-Hua Yu | 2024-12-03 |
| 12142560 | Semiconductor packages and methods of forming same | Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng | 2024-11-12 |
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee | 2024-11-12 |
| 12119229 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng | 2024-10-15 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng | 2024-10-15 |
| 12107051 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Ming-Da Cheng | 2024-10-01 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2024-08-27 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2024-08-27 |