Issued Patents All Time
Showing 76–100 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2024-02-13 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen | 2024-02-06 |
| 11854988 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2023-12-26 |
| 11855016 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-19 |
| 11837550 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Ming-Da Cheng | 2023-12-05 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2023-12-05 |
| 11817380 | Semiconductor package and method of forming same | Jiun Yi Wu, Chen-Hua Yu | 2023-11-14 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2023-10-24 |
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng | 2023-10-03 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Shou-Zen Chang, Chao-Wen Shih | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2023-09-05 |
| 11749535 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng | 2023-09-05 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11741737 | Fingerprint sensor in info structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2023-08-29 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2023-08-22 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2023-08-15 |
| 11721659 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2023-08-08 |
| 11721555 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao | 2023-08-08 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2023-07-18 |