Issued Patents All Time
Showing 126–150 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2022-12-20 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Ching-Hua Hsieh, Chen-Hua Yu, Hsin-Hung Liao, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2022-12-20 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11515272 | Semiconductor die contact structure and method | Chen-Hua Yu | 2022-11-29 |
| 11506843 | Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2022-11-22 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2022-11-08 |
| 11488908 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Han-Ping Pu, Ting-Chu Ko | 2022-11-01 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2022-11-01 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11456226 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chih-Wei Lin | 2022-09-27 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2022-09-20 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2022-09-13 |
| 11432372 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee | 2022-08-30 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |
| 11417638 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-08-16 |
| 11417633 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2022-08-16 |
| 11410953 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2022-08-09 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2022-08-02 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Meng-Tse Chen, Ming-Da Cheng +1 more | 2022-07-19 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Chih-Wei Lin, Ming-Da Cheng, Chen-Shien Chen | 2022-07-12 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng | 2022-06-07 |
| 11355428 | Semiconductor package | Jiun Yi Wu, Chen-Hua Yu | 2022-06-07 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kuo, Ming-Da Cheng | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-05-24 |