Issued Patents All Time
Showing 151–175 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322360 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng | 2022-05-03 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2022-03-22 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11257714 | Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same | Chien Ling Hwang, Yi-Wen Wu, Chun-Chieh Wang | 2022-02-22 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11251099 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chen-Hua Yu | 2022-02-15 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2022-02-08 |
| 11239201 | 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Wen-Chih Chiou | 2022-02-01 |
| 11239193 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chen-Hua Yu | 2022-02-01 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2022-02-01 |
| 11233032 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2022-01-25 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chen-Hua Yu | 2022-01-04 |
| 11217538 | Integrated circuit package and method | Jiun Yi Wu, Chien-Hsun Lee | 2022-01-04 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2022-01-04 |
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2021-12-28 |
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2021-12-28 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2021-12-07 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +2 more | 2021-11-23 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2021-10-19 |