Issued Patents All Time
Showing 176–200 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145614 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2021-10-12 |
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Ying-Jui Huang | 2021-10-05 |
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2021-10-05 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2021-09-28 |
| 11133283 | Integrated fan-out device | Jiun Yi Wu, Chen-Hua Yu | 2021-09-28 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chien Ling Hwang +2 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung | 2021-09-14 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +1 more | 2021-09-14 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2021-08-31 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-08-24 |
| 11101232 | Conductive micro pin | Ying-Jui Huang, Hsin-Hung Liao, Chien Ling Hwang | 2021-08-24 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Ying-Jui Huang | 2021-08-17 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2021-08-10 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2021-06-29 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2021-06-29 |
| 11043731 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2021-06-22 |