Issued Patents All Time
Showing 226–250 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Chen-Hua Yu, Meng-Tse Chen, Ming-Da Cheng | 2020-12-15 |
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Yi-Yang Lei, Wei Huang | 2020-12-15 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2020-12-15 |
| 10861823 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2020-12-08 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10853616 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2020-12-01 |
| 10854552 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2020-12-01 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2020-11-24 |
| 10847459 | Semiconductor die contact structure and method | Chen-Hua Yu | 2020-11-24 |
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho | 2020-11-17 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen +1 more | 2020-11-10 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2020-10-06 |
| 10790269 | Semiconductor devices and semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2020-09-29 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10790252 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo | 2020-09-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai, Cheng-Ting Chen | 2020-09-22 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2020-09-08 |