Issued Patents All Time
Showing 276–300 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2020-02-04 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2020-01-14 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10535616 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng | 2020-01-14 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2020-01-14 |
| 10534353 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, Cheng-Ting Chen, James Hu | 2020-01-14 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2019-12-17 |
| 10510731 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2019-12-17 |
| 10509938 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2019-12-17 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2019-12-17 |
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2019-12-10 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10490521 | Advanced structure for info wafer warpage reduction | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-11-26 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng | 2019-11-26 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho | 2019-11-19 |
| 10483617 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2019-11-19 |
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Ming-Da Cheng | 2019-11-12 |