Issued Patents All Time
Showing 301–325 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Ming-Da Cheng | 2019-11-12 |
| 10468377 | Device package including molding compound having non-planar top surface around a die | Chen-Hua Yu, Meng-Tse Chen, Ming-Da Cheng | 2019-11-05 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2019-10-29 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2019-10-29 |
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chien-Hsiun Lee, Hsien-Wei Chen | 2019-10-22 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-08-06 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Shou-Zen Chang, Chao-Wen Shih | 2019-07-16 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2019-07-16 |
| 10340236 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2019-07-02 |
| 10325883 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Ching-Hua Hsieh, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10325853 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Ming-Da Cheng | 2019-06-18 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Jiun Yi Wu | 2019-06-11 |
| 10319701 | Bonded 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Wen-Chih Chiou | 2019-06-11 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih +2 more | 2019-06-04 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo +3 more | 2019-05-28 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2019-05-21 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2019-04-30 |
| 10276541 | 3D package structure and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2019-04-30 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2019-04-30 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2019-04-30 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2019-04-23 |