Issued Patents All Time
Showing 251–275 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2020-08-04 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2020-08-04 |
| 10727074 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao | 2020-07-28 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2020-07-21 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2020-07-14 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10707084 | Method of manufacturing wafer level chip scale package | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng | 2020-07-07 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chien Ling Hwang +2 more | 2020-06-30 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2020-06-30 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-06-30 |
| 10679866 | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Ying-Jui Huang | 2020-06-09 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2020-06-02 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng | 2020-05-26 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2020-05-26 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2020-05-19 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2020-05-19 |
| 10643916 | Conductive line system and process | Yu Yi Huang, Hung-Jui Kuo | 2020-05-05 |
| 10638616 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2020-04-28 |
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chih-Wei Lin | 2020-04-28 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang +1 more | 2020-03-24 |
| 10586724 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kou, Ming-Da Cheng | 2020-03-10 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |