Issued Patents All Time
Showing 326–350 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269747 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo | 2019-04-23 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2019-04-23 |
| 10269675 | Conductive line system and process | Yu Yi Huang, Hung-Jui Kuo | 2019-04-23 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2019-04-23 |
| 10268868 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2019-04-23 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2019-04-16 |
| 10192848 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng | 2019-01-29 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang +1 more | 2019-01-29 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Albert Wan, Yu-Sheng Hsieh, Chao-Wen Shih, Shou-Zen Chang, Chen-Hua Yu | 2019-01-22 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2019-01-08 |
| 10170434 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng | 2019-01-01 |
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10163837 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Yi-Wen Wu | 2018-12-25 |
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2018-12-25 |
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2018-12-25 |
| 10163785 | Semiconductor die contact structure and method | Chen-Hua Yu | 2018-12-25 |
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-12-25 |
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Chia-Lun Chang | 2018-12-18 |
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2018-12-18 |
| 10157849 | Packages with molding structures and methods of forming the same | Chih-Fan Huang, Cheng-Tar Wu, Ming-Da Cheng, Chen-Hua Yu | 2018-12-18 |
| 10157893 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng | 2018-12-18 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-12-18 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai +1 more | 2018-12-18 |