Issued Patents All Time
Showing 376–400 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Chih-Wei Lin, Ming-Da Cheng, Chen-Shien Chen | 2018-06-05 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-05-22 |
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho | 2018-04-24 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng | 2018-04-10 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2018-04-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen +1 more | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2018-04-03 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911724 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai, Chen-Hua Yu | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-02-27 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Hung-Jui Kuo, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2018-02-20 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chih-Wei Lin, Hui-Min Huang, Chun-Cheng Lin, Ming-Da Cheng | 2018-02-13 |
| 9893044 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2018-02-13 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-02-06 |
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng | 2018-02-06 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2018-01-23 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-01-16 |