Issued Patents All Time
Showing 426–450 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2017-09-19 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2017-09-19 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2017-09-12 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-09-12 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chia-Wei Tu, Ming-Da Cheng, Wen-Hsiung Lu, Yu-Peng Tsai | 2017-09-05 |
| 9754805 | Packaging method and structure | Chen-Hua Yu, Ching-Hua Hsieh, Ming-Da Cheng | 2017-09-05 |
| 9741586 | Method of fabricating package structures | Yu-Hsiang Hu, Hung-Jui Kuo, Sih-Hao Liao | 2017-08-22 |
| 9735039 | Apparatus for separating wafer from carrier | Chien Ling Hwang, Lin-Wei Wang | 2017-08-15 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2017-08-08 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2017-07-18 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang | 2017-07-11 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu | 2017-07-04 |
| 9691726 | Methods for forming fan-out package structure | Ming-Da Cheng, Hsien-Wei Chen, Cheng-Lin Huang, Meng-Tse Chen | 2017-06-27 |
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho | 2017-06-27 |
| 9691745 | Bonding structure for forming a package on package (PoP) structure and method for forming the same | James Hu, Ming-Da Cheng | 2017-06-27 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Hui-Jung Tsai, Yi-Wen Wu | 2017-06-20 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng | 2017-06-13 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang | 2017-05-30 |
| 9659918 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Dean Wang, Chen-Shien Chen, Jiun Yi Wu | 2017-05-23 |
| 9659805 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kuo, Ming-Da Cheng | 2017-05-23 |
| 9661794 | Method of manufacturing package structure | Shou-Zen Chang, Chen-Hua Yu, Kai-Chiang Wu, Wei-Ting Lin | 2017-05-23 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-05-02 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2017-04-18 |
| 9627369 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng | 2017-04-18 |