Issued Patents All Time
Showing 51–75 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2024-08-27 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chih-Wei Lin | 2024-08-06 |
| 12051650 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2024-07-30 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12033883 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kuo, Ming-Da Cheng | 2024-07-09 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2024-06-25 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2024-06-18 |
| 12009575 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2024-06-11 |
| 12009345 | 3D package structure and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2024-06-11 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2024-06-04 |
| 12002767 | Integrated circuit package and method | Jiun Yi Wu, Chien-Hsun Lee | 2024-06-04 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee | 2024-05-14 |
| 11984374 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chen-Hua Yu | 2024-05-14 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2024-04-16 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chen-Hua Yu | 2024-04-16 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2024-04-09 |
| 11955442 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2024-04-09 |
| 11953740 | Package structure | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2024-03-19 |