Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2022-05-24 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Tian Hu | 2022-03-29 |
| 11282804 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-03-22 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |
| 11270927 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2022-03-08 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-01-18 |
| 11201079 | Wafer chuck | Chen-Hua Yu, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2021-12-14 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang, Yung-Chi Chu +1 more | 2021-11-02 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2021-09-07 |
| 11049812 | Semiconductor devices and methods of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Meng-Che Tu | 2021-06-29 |
| 11031289 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-06-08 |
| 11004796 | Integrated fan-out package | Meng-Che Tu, Hung-Jui Kuo, Yu-Hsiang Hu | 2021-05-11 |
| 10978405 | Integrated fan-out package | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu | 2021-04-13 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2020-12-01 |
| 10833053 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2020-11-10 |
| 10797023 | Integrated fan-out package and method of fabricating an integrated fan-out package | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-10-06 |
| 10665545 | Semiconductor devices, semiconductor packages and methods of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Meng-Che Tu | 2020-05-26 |
| 10658208 | Polyimide composition for package structure, package structure and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-05-19 |
| 10658199 | Semiconductor device and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-05-19 |
| 10658287 | Semiconductor device having a tapered protruding pillar portion | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-05-19 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-03-31 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Po-Han Wang | 2019-12-17 |
| 10510704 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2019-12-17 |