Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394741 | Integrated circuit packages having adhesion layers for through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-19 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12293988 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-05-06 |
| 12249588 | Semiconductor device and methods of manufacture | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-03-11 |
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11948863 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2024-04-02 |
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-17 |
| 11715717 | Methods of forming integrated circuit packages having adhesion layers over through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-01 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-14 |
| 11594472 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2023-02-28 |
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-09-27 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-08-16 |
| 11270927 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2022-03-08 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang +1 more | 2021-11-02 |
| 10833053 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2020-11-10 |