Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393749 | Stacked via structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2022-07-19 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-05-24 |
| 11309265 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2022-04-19 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-01-18 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu +1 more | 2021-11-02 |
| 11121006 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu | 2021-09-14 |
| 11101176 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-08-24 |
| 10998202 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu | 2021-05-04 |
| 10964650 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10879147 | Method of manufacturing package structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-12-29 |
| 10872864 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-12-22 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2020-12-01 |
| 10804946 | Low power wake-up receiver | Haowei Jiang, Drew Hall, Patrick Mercier | 2020-10-13 |
| 10790212 | Method of manufacturing package structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-09-29 |
| 10763206 | Method of fabricating integrated fan-out packages | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-09-01 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-07-14 |
| 10529593 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-01-07 |
| 10529675 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2020-01-07 |
| 10522440 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2019-12-31 |
| 10510645 | Planarizing RDLs in RDL-first processes through CMP process | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2019-12-17 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2019-12-17 |
| 10332856 | Package structure and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2019-06-25 |
| 10283461 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2019-05-07 |
| 9836396 | Method for managing a last level cache and apparatus utilizing the same | Cheng Li, Chia-Lin Yang | 2017-12-05 |
| 8570332 | Graphics processing system with power-gating control function, power-gating control method, and computer program products thereof | Chia-Lin Yang, Yu-Jung Cheng | 2013-10-29 |