Issued Patents All Time
Showing 51–75 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094830 | Integrated fan-out (InFO) package structure | Ming-Che Ho, Tzung-Hui Lee | 2024-09-17 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2024-09-10 |
| 12080609 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hui-Jung Tsai, Chih-Yu Wang | 2024-09-03 |
| 12068273 | Package | Tian Hu, Yu-Hsiang Hu, Sih-Hao Liao | 2024-08-20 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hui-Jung Tsai | 2024-08-13 |
| 12033883 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Ming-Da Cheng | 2024-07-09 |
| 12032295 | Optical lithography system and method of using the same | Ting-Yang Yu, Ming-Tan Lee | 2024-07-09 |
| 12021026 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2024-06-25 |
| 12020983 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2024-06-25 |
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Sih-Hao Liao, Yu-Hsiang Hu | 2024-06-11 |
| 12009226 | Semiconductor device and method of forming same | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu | 2024-06-11 |
| 11996381 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2024-05-28 |
| 11990383 | Package structure having at least one die with a plurality of taper-shaped die connectors | Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang | 2024-05-21 |
| 11977333 | Semiconductor devices and methods of manufacturing | Hsing-Chieh Lee, Ming-Tan Lee | 2024-05-07 |
| 11973023 | Stacked via structure | Po-Han Wang, Yu-Hsiang Hu | 2024-04-30 |
| 11961811 | Semiconductor structures and method of manufacturing the same | Chen-Hua Yu, Hui-Jung Tsai, Tsao-Lun Chang | 2024-04-16 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Jung Wei Cheng +3 more | 2024-04-16 |
| 11960211 | Optical lithography system and method of using the same | Ting-Yang Yu, Ming-Tan Lee | 2024-04-16 |
| 11948904 | Die and package structure | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2024-04-02 |
| 11948918 | Redistribution structure for semiconductor device and method of forming same | Po-Han Wang, Yu-Hsiang Hu | 2024-04-02 |
| 11948890 | Semiconductor package and method | Shih-Hao Tseng, Ming-Che Ho | 2024-04-02 |
| 11948863 | Package structure and method of forming the same | Hung-Chun Cho, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2024-04-02 |
| 11942435 | Semiconductor package and method | Po-Han Wang, Yu-Hsiang Hu | 2024-03-26 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu | 2024-03-26 |
| 11923207 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Chen-Hua Yu | 2024-03-05 |