Issued Patents All Time
Showing 76–100 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901230 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Ming-Che Ho | 2024-02-13 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2024-02-06 |
| 11892774 | Lithography | Meng-Che Tu, Po-Han Wang, Sih-Hao Liao, Yu-Hsiang Hu | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2024-01-09 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Ting-Chen Tseng, Yu-Hsiang Hu, Sih-Hao Liao | 2024-01-02 |
| 11862512 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Chen-Cheng Kuo | 2024-01-02 |
| 11862560 | Package structure and method of manufacturing the same | Yung-Chi Chu, Yu-Hsiang Hu, Wei-Chih Chen | 2024-01-02 |
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11855246 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hui-Jung Tsai | 2023-12-26 |
| 11854927 | Semiconductor package and method of forming same | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu | 2023-12-26 |
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu | 2023-12-26 |
| 11842902 | Semiconductor package with alignment mark and manufacturing method thereof | Po-Han Wang, Yu-Hsiang Hu | 2023-12-12 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Chen-Hua Yu, Ming-Che Ho, Tzung-Hui Lee | 2023-12-12 |
| 11842896 | Semiconductor devices and methods of manufacturing | Hsing-Chieh Lee, Ming-Tan Lee | 2023-12-12 |
| 11841618 | Photoresist system and method | De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee | 2023-12-12 |
| 11837502 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2023-12-05 |
| 11823936 | Alignment holder and testing apparatus | Chih-Yu Wang, Hui-Jung Tsai | 2023-11-21 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2023-11-21 |
| 11823981 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Ming-Che Ho | 2023-11-21 |
| 11817352 | Method of fabricating redistribution circuit structure | Po-Han Wang, Yu-Hsiang Hu | 2023-11-14 |
| 11817399 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Yu-Hsiang Hu | 2023-11-14 |
| 11798893 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Jhih-Yu Wang, Yu-Hsiang Hu | 2023-10-24 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-24 |
| 11789366 | Method for removing resist layer, and method of manufacturing semiconductor | Hui-Jung Tsai, Tai-Min Chang | 2023-10-17 |
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho | 2023-10-17 |