Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128182 | Semiconductor package structure and manufacturing method thereof | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2018-11-13 |
| 10090267 | Bump structure and method for forming the same | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-10-02 |
| 9997482 | Solder stud structure | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-06-12 |
| 9922896 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2018-03-20 |
| 9806046 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2017-10-31 |
| 9779969 | Package structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2017-10-03 |
| 9735123 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Yi-Jen Lai, Chun-Jen Chen | 2017-08-15 |
| 9391067 | Multiple silicide integration structure and method | Der-Chyang Yeh, Hsing-Kuo Hsia, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su | 2016-07-12 |
| 9209048 | Two step molding grinding for packaging applications | Wen-Chun Huang, Chien-Chen Li, Kuo-Chio Liu, Ruey-Yun Shiue, Chih-Hsien Lin +3 more | 2015-12-08 |
| 8993393 | Multiple silicide integration structure and method | Der-Chyang Yeh, Hsing-Kuo Hsia, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su | 2015-03-31 |
| 7667835 | Apparatus and method for preventing copper peeling in ECP | Jung-Chih Tsao, Hsien-Ping Feng, Ming-Yuan Cheng, Steven Lin, Ray Chuang | 2010-02-23 |
| 7528478 | Semiconductor devices having post passivation interconnections and a buffer layer | Hung-Ju Chien, Hsun-Chang Chan, Chu-Chang Chen, Ying-Lang Wang, Chin-Hao Su +2 more | 2009-05-05 |
| 7432192 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Chih-Tsung Lee, Ming-Yuan Cheng, Steven Lin +2 more | 2008-10-07 |
| 7262067 | Method for conductive film quality evaluation | Hsien-Ping Feng, Min-Yuan Cheng, Steven Lin, Huang-Yi Huang, Yuh-Da Fan | 2007-08-28 |
| 7256120 | Method to eliminate plating copper defect | Jung-Chin Tsao, Chi-Wen Liu, Hsien-Ping Feng, Steven Lin, Min-Yuan Cheng | 2007-08-14 |
| 7030016 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Chih-Tsung Lee, Ming-Yuan Cheng, Steven Lin +2 more | 2006-04-18 |
| 7026233 | Method for reducing defects in post passivation interconnect process | Hung-Ju Chien, Hsun-Chang Chan, Chu-Chang Chen, Ying-Lang Wang, Chin-Hao Su +2 more | 2006-04-11 |
| 6985222 | Chamber leakage detection by measurement of reflectivity of oxidized thin film | Chu-Chang Chen, Ting-Chun Wang, Szu-An Wu, Ying-Lang Wang, Hsien-Ping Feng | 2006-01-10 |
| 6863491 | Catch-pin water support for process chamber | Chun-Tse Lin, Ting-Chun Wang, Yu-Ku Lin, Ying-Lang Wang | 2005-03-08 |
| 6695921 | Hoop support for semiconductor wafer | Ting-Chu Wang, Yu-Ku Lin, Chin-Te Huang, Huai-Tei Yang, Chun-Chang Chen +1 more | 2004-02-24 |
| 6585826 | Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles | Yali Tai, Shih-Chi Lin, Wen-Long Lee, Francis Wang, Szu-An Wu +1 more | 2003-07-01 |
| 6482290 | Sweeping slurry dispenser for chemical mechanical polishing | Yi-Wei Chang, Li-Hsiao Chao, Tzut Hsun Huang | 2002-11-19 |