Issued Patents All Time
Showing 426–450 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Kim Hong Chen | 2018-04-10 |
| 9935080 | Three-layer Package-on-Package structure and method forming same | Jui-Pin Hung, Feng-Cheng Hsu | 2018-04-03 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2018-03-27 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9911629 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2018-03-06 |
| 9899467 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Ebin Liao | 2018-02-20 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Po-Yao Lin, Cheng-Lin Huang, Shyue-Ter Leu | 2018-01-30 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |
| 9831224 | Solution for reducing poor contact in info packages | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin | 2017-11-28 |
| 9806062 | Methods of packaging semiconductor devices and packaged semiconductor devices | Wen-Chih Chiou, Tu-Hao Yu, Hung-Jung Tu, Yu-Liang Lin, Shih-Hui Wang | 2017-10-31 |
| 9786567 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Wei-Cheng Wu, Li-Han Hsu, Sao-Ling Chiu, Shang-Yun Hou, Chen-Hua Lin | 2017-10-10 |
| 9780072 | 3D semiconductor package interposer with die cavity | Shang-Yun Hou, Kim Hong Chen, Wensen Hung, Szu-Po Huang | 2017-10-03 |
| 9760670 | Semiconductor device design methods and conductive bump pattern enhancement methods | Tzu-Yu Wang, Wei-Cheng Wu, Kuo-Ching Hsu, Shang-Yun Hou | 2017-09-12 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin +4 more | 2017-08-29 |
| 9741638 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shang-Yun Hou, Way Lee Cheng | 2017-08-22 |
| 9735129 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Jie Chen, Der-Chyang Yeh, Chen-Hua Yu | 2017-08-15 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu | 2017-08-15 |
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu +2 more | 2017-06-27 |
| 9679783 | Molding wafer chamber | Jing-Cheng Lin, Chin-Chuan Chang, Jui-Pin Hung, Szu-Wei Lu, Chen-Hua Yu | 2017-06-13 |
| 9666522 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Chen-Hua Yu | 2017-05-30 |
| 9660016 | Method of manufacturing a capacitor | Chun Hua Chang, Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou +1 more | 2017-05-23 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Ming-Chih Yew, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2017-05-16 |
| 9640490 | Through silicon via keep out zone formation method and system | Cheng-Chieh Hsieh, Hung-An Teng, Shang-Yun Hou | 2017-05-02 |
| 9633869 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou +1 more | 2017-04-25 |