Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741638 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shin-Puu Jeng, Shang-Yun Hou | 2017-08-22 |
| 9337123 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2016-05-10 |