Issued Patents All Time
Showing 326–350 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2020-10-06 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Kuang-Chun Lee, Yu-Sheng Lin, Po-Yao Lin | 2020-09-29 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2020-09-29 |
| 10784220 | Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer | Shuo-Mao Chen, Feng-Cheng Hsu | 2020-09-22 |
| 10770437 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen | 2020-09-08 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2020-09-01 |
| 10756064 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Jui-Pin Hung | 2020-08-25 |
| 10748882 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Hsien-Wen Liu | 2020-08-18 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2020-08-11 |
| 10741404 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2020-08-11 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2020-08-04 |
| 10727294 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Ebin Liao | 2020-07-28 |
| 10727198 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2020-07-28 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10707142 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2020-07-07 |
| 10692813 | Semiconductor package with dummy bumps connected to non-solder mask defined pads | Feng-Cheng Hsu | 2020-06-23 |
| 10692764 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou | 2020-06-23 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2020-05-26 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou | 2020-05-26 |
| 10665473 | Package structure and method of fabricating the same | Chia-Hsiang Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Arunima Banerjee | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, De-Dui Liao | 2020-04-28 |