Issued Patents 2024
Showing 51–75 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2024-08-06 |
| 12051616 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2024-07-30 |
| 12051652 | Package structure and method of fabricating the same | Shih-Ting Lin, Chi-Hsi Wu, Szu-Wei Lu | 2024-07-30 |
| 12051650 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2024-07-30 |
| 12051649 | Architecture for computing system package | Chieh-Yen Chen, Chuei-Tang Wang, Chung-Hao Tsai | 2024-07-30 |
| 12044892 | Package structure including photonic package and interposer having waveguide | Hsing-Kuo Hsia | 2024-07-23 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12040566 | Antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee | 2024-07-16 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12038599 | Photonic package and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Jiun Yi Wu, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Chung-Hao Tsai, Tzu-Chun Tang, Chuei-Tang Wang | 2024-07-09 |
| 12033976 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Kuo-Chung Yee | 2024-07-09 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Yi-Li Hsiao | 2024-07-02 |
| 12020953 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12021053 | Semiconductor package and method | Jiun Yi Wu | 2024-06-25 |
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chung-Hao Tsai, Chia-Chia Lin, Kai-Chiang Wu, Chuei-Tang Wang | 2024-06-25 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu | 2024-06-25 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2024-06-25 |
| 12020983 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2024-06-25 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Kuo-Chung Yee, Chun-Hui Yu | 2024-06-18 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 12015008 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12009575 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2024-06-11 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2024-06-11 |