Issued Patents 2024
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12183700 | Semiconductor device package and method of manufacture | Chen-Hua Yu | 2024-12-31 |
| 12170267 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu | 2024-12-17 |
| 12165941 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Lee | 2024-12-10 |
| 12159822 | Method of manufacturing a semiconductor package having conductive pillars | Chen-Hua Yu, Chung-Shi Liu | 2024-12-03 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 12119292 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2024-10-15 |
| 12100672 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2024-09-24 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2024-08-27 |
| 12068297 | Hybrid integrated circuit package | Chen-Hua Yu, Hsing-Kuo Hsia | 2024-08-20 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 12062619 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Yen-Ping Wang | 2024-08-13 |
| 12057410 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2024-08-06 |
| 12051650 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2024-07-30 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12021053 | Semiconductor package and method | Chen-Hua Yu | 2024-06-25 |
| 12002767 | Integrated circuit package and method | Chung-Shi Liu, Chien-Hsun Lee | 2024-06-04 |
| 11984374 | Warpage control of packages using embedded core frame | Chen-Hua Yu, Chung-Shi Liu | 2024-05-14 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Chung-Shi Liu, Chen-Hua Yu | 2024-04-16 |
| 11955442 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2024-04-09 |
| 11935761 | Semiconductor package and method of forming thereof | Chen-Hua Yu | 2024-03-19 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang | 2024-02-06 |