Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2024-04-16 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |