Issued Patents 2024
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chien-Hsun Lee, Jiun Yi Wu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12170267 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2024-12-17 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12159822 | Method of manufacturing a semiconductor package having conductive pillars | Jiun Yi Wu, Chen-Hua Yu | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-12-03 |
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng | 2024-11-12 |
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee | 2024-11-12 |
| 12142560 | Semiconductor packages and methods of forming same | Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng | 2024-10-15 |
| 12119229 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng | 2024-10-15 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12107051 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Ming-Da Cheng | 2024-10-01 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12074127 | Semiconductor die contact structure and method | Chen-Hua Yu | 2024-08-27 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2024-08-27 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2024-08-27 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chih-Wei Lin | 2024-08-06 |
| 12051650 | Semiconductor package and method | Jiun Yi Wu, Chen-Hua Yu | 2024-07-30 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12033883 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kuo, Ming-Da Cheng | 2024-07-09 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2024-06-25 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |