Issued Patents 2024
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165966 | Package and method of manufacturing the same | Meng-Che Tu, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-12-10 |
| 12147159 | Semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2024-11-19 |
| 12119235 | Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-10-15 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2024-09-17 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Tian Hu | 2024-09-10 |
| 12068273 | Package | Tian Hu, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-08-20 |
| 12009226 | Semiconductor device and method of forming same | Ting-Chen Tseng, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2024-04-16 |
| 11948904 | Die and package structure | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-04-02 |
| 11948863 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2024-04-02 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11892774 | Lithography | Meng-Che Tu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-02-06 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2024-01-09 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Yu-Hsiang Hu | 2024-01-02 |