Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094765 | Integrated circuit package and method | Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12009226 | Semiconductor device and method of forming same | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-01-02 |