Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170223 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-12-17 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-09-17 |
| 12051659 | Semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2024-07-30 |
| 11973023 | Stacked via structure | Hung-Jui Kuo, Yu-Hsiang Hu | 2024-04-30 |
| 11948918 | Redistribution structure for semiconductor device and method of forming same | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-04-02 |
| 11942435 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2024-03-26 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11892774 | Lithography | Meng-Che Tu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-02-06 |