Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142601 | Micro light-emitting diode package structure and micro light-emitting diode display apparatus | Yen-Yeh Chen | 2024-11-12 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2024-09-10 |
| 11942417 | Sensor package and method | Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-02-06 |
| 11869418 | Micro light emitting diode display panel | Shiang-Ning Yang, Chang-Rong Lin, Yu-Ya Peng | 2024-01-09 |
| 11862560 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2024-01-02 |
| 11862614 | Micro LED display device and manufacturing method thereof | Yu-Hung Lai, Pei-Hsin Chen, Yi-Ching Chen, Yi-Chun Shih | 2024-01-02 |