Issued Patents 2024
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183691 | Semiconductor structure and method of forming the same | Ching-Wen Chen, Ming-Che Ho | 2024-12-31 |
| 12176321 | Semiconductor packages and method of forming the same | Hui-Jung Tsai, Chia-Wei Wang, Yu-Tzu Chang | 2024-12-24 |
| 12170223 | Method of fabricating redistribution circuit structure | Po-Han Wang, Yu-Hsiang Hu | 2024-12-17 |
| 12164232 | Method for removing resistor layer, and method of manufacturing semiconductor | Hui-Jung Tsai, Tai-Min Chang | 2024-12-10 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12165966 | Package and method of manufacturing the same | Meng-Che Tu, Sih-Hao Liao, Yu-Hsiang Hu | 2024-12-10 |
| 12148651 | Chuck design and method for wafer | Chen-Hua Yu, Ming-Tan Lee | 2024-11-19 |
| 12148732 | Package structure and method of fabrcating the same | Hui-Jung Tsai, Chia-Wei Wang, Yu-Tzu Chang | 2024-11-19 |
| 12147159 | Semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2024-11-19 |
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Kai-Chiang Wu, Ming-Che Ho | 2024-10-29 |
| 12132023 | Integrated circuit, package structure, and manufacturing method of package structure | Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang | 2024-10-29 |
| 12125741 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Chen-Cheng Kuo | 2024-10-22 |
| 12119235 | Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2024-10-15 |
| 12119229 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12094830 | Integrated fan-out (InFO) package structure | Ming-Che Ho, Tzung-Hui Lee | 2024-09-17 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu | 2024-09-17 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2024-09-10 |
| 12080609 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hui-Jung Tsai, Chih-Yu Wang | 2024-09-03 |
| 12068273 | Package | Tian Hu, Yu-Hsiang Hu, Sih-Hao Liao | 2024-08-20 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hui-Jung Tsai | 2024-08-13 |
| 12033883 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Ming-Da Cheng | 2024-07-09 |
| 12032295 | Optical lithography system and method of using the same | Ting-Yang Yu, Ming-Tan Lee | 2024-07-09 |
| 12021026 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2024-06-25 |
| 12020983 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2024-06-25 |